MATERIALS

More & more applications require higher performances
on the Printed Circuit Board


Higher Density
- BGA-CSP packaging

High speed signals
- Frequency range : 200 MHz to 10 GHz
- Low dielectric constant

New base materials
- Higher performance
- More dedicated to the specifics applications

Reliability
- High thermal stress on high aspectt ratio holes
- Repair on BGA & CSP (local thermal chock)
- FR4 still primary material - Now and Future
- High Tg materials (160°C) is recommended :
- More than 8 layers
- High aspectt Ratio (> 7 : 1)
- High I/O components (BGA)
- Low Z axis expansion rates :
- Tg slightly lower back

High Frequency
- Roger RO 4003
- Significant experience
- Not a PTFE materials
- Standard process manufacturing
- Can be combined with other substrate
- Alternative materials APPE, PPE, PPO (Nelco N4000.13, N6000, Getek, ...)
- Adapted at different range of frequency at the best cost
- Multiple sources

List of examples of High Frequency Laminates

Arlon : http://www.arlon-med.com
Neltec : http://www.parkelectro.com/index.htm
Taconic : http://www.taconic-add.com/en/products.php
Rogers : http://www.rogerscorporation.com

Others base materials processed in Elvia Group