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TECHNOLOGIES
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HDI PCB
IPC definitions:
- High Interconnections level
- Large Size
- Thin Dielectrics
- Thin Line and space
- µvias
- Sequential
- build up
- High aspect Ratio
Production capabilities:
- Full automized exposure machine
( +/- 50µm accuracy)
- High speed spindle drilling machine
- Electroplating line AR >12
- Electrical test equipment full adapted :
Flying Probe ( 14 probes)
High skins ( fixture) |
- Base Materials: High Tg / Low CTE preferred
- High layers count: Up to 18 Layers
- Large Size: 560 x 320 mm
- High aspectt ratio: 10 :1
(0.3mm drilled holes / 3mm thick board)
- Micro vias: 2 sides of laser Via holes
- High I/O count: 1300I/O per BGA
- Density: 100µm line width & space or less
- Controlled impedances: On each layers
(microstrip, stripline, differential stripline)
- Buried capacitance:
(high pot test on inner layer & finish product)
High density = BGA large size or fine pitch
aspect Ratio (Total thickness/ drilled hole diameter) > 10
High count of layers (>16) with thin dielectrics
Reliability:
more than 1000 VRT (- 55/+125°C)
- Low Cte materials
- Adpated plating line and chemistry
- selective metallic finishes (Niau or Sn) |
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