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µVIAS PCB

Large Windows Process: Copper etched before laser drilling, larger than holes diameter - perfect plating - same thickness as in PTH - High level of reliability Build up : Reinforced materials ( Low CTE , High Tg, Polyimide, low Dk,…) Cost effective solution for high density: - 1 to 3 µvias level - Buried µvias - µvias on BVH - µvias and Seqential build up