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TECHNOLOGIES
 Technologies available
- Double sided
- Multilayers from 4 to 22 layers
- Sequential lamination / drilling
- Drain
- HDI technology 3 + N + 3
- Laser vias
- Pad on hole
- Burried vias
- flex-rigid boards
- IMS
Line and Space
- Automatic imaging
- AOI for inner and external layers
- Acid copper etching for innerlayers
- Alkaline etching for external layers |
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Drilling
High performance equipments:
- 5 Hitachi + 2 Excellon (35 heads)
- 6000 vias/ hour/ equipment
- Diameter and length automatic controlled |
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Microvia
High performance equipments:
- 3 GSI Lumonics YAG / CO2
- Staggered and stacked vias
- 30 vias / sec with YAG/CO2
60 vias / sec with CO2 |
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Solder mask
- Automatic imaging
- Imaging / developing / curing in line
- 2 coating process: curtain and vertical screening (both sides simultaneously)
- SMD |
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Surface finishes
Bi-finishes ENIG/OSP
- ENIG for contact pad (key board, test pad…)
- OSP for soldering pads => no intermetallic |
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